Thermal Interface Materials Market: Global Industry Trends, Growth and Forecast to 2020: P&S Market Research

The thermal interface materials market is growing, due to electrification of transportation industry, growing light emitting diode (LED) market, enhanced need for seamless connectivity, and sophisticated electronics. The high-performance thermal interface materials in the form of nano diamonds and increasing use of carbon nanotubes as heat sinks are some of the factors, providing ample growth opportunities for the thermal interface materials market. One of the major factors restraining the growth of the market is its physical properties that limit thermal interface material’s performance.

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The greases and adhesives lead the type segment in the market, followed by tapes and films segment. Due to the ability of greases and adhesives to flow into any nook of the intended application, OEMs prefer to use them on the surface roughness in the housing. The phase change materials segment is growing with the highest rate in the market. Among the applications, computer segment leads the market followed by telecom. The thermal interface materials are used for the development of cutting-edge devices employed in surgical, diagnostic, and imaging applications. The medical device application segment is expected to grow with the highest rate in the coming years. The increasing demand for effective, smaller, and lighter medical equipment is supporting the high growth of medical device application segment in the global market.
Asia-Pacific leads the global thermal interface materials market. The Asia-Pacific market is also expected to grow with the highest rate in coming years, where India, Japan, and China are offering considerable growth opportunities. This is due to the growth in end-use industries of the countries such as telecom, electrical and electronics, medical, and automotive.

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To minimize the interface thermal resistance between heat sources and heat sinks, the small imperfections and voids are filled with the thermal interface materials. The thermal interface materials are used to connect two components and remove air gaps from the interface, by producing a thermally conductive bond for transferring heat from crucial operating components of the device. In electric vehicles which have large energy storage systems, heat management is necessary. As vehicles are incorporated with more electronics and electrical components, thermal management is becoming progressively important.
Due to the micro-scale surface unevenness, the contact area among heat sinks and high power heat generating components is less than 4%. To enhance heat conduction through the interface and reduction in thermal interfacial resistance, the thermal interface materials are used. Also, for enhancing the device efficacy, proper selection of thermal interface materials is an essential step. Investing in the interface material is more effective than applying various cooling techniques, so as to create a suitable thermal contact.

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Some of the competitors in the thermal interface materials market are Parker Hannifin Corporation, Laird Technologies Inc., Wakefield-Vette Inc., Dow Corning Corporation, Honeywell International Inc., Momentive Performance Materials Inc., Zalman Tech Co. Ltd., Henkel AG & Co. KGAA, Indium Corporation, and 3M Company.

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